Here is a no network way of diagnostic:
Run a test with Eeprom tools 3.1 and 4.0 this gives a point
next its important if the test is good and no network, I mean phone cant even see it next steps:
Put SIM card, power on, dial a service number and put phone close to a turned on radio /close to the antena/ if there is a conection with network U will here “puk, puk, puk, puk/ if U dont hear it this solves the problem in most cases
1. Reheat CCONT-> check phone
2.Reheat COBBA -> check phone
3.Reheat HAGAR-> check phone
If there is network but cant make a call this is PA- U will not hear puk puk puk on radio test..
Tip..HAGAR is a DSP processor the phone is registering with network with it
But in nokia phones /DCT3/ problems are mostly around CCONT and COBBA
Well only reheating doesnt do the job…U need to touch the chip to be sure that bubles under it are solder properly..When Im saing touch it must be a gentle one like U touch a woman…not to smash it to the PCB..
Tip: Use temperatyre no more than 310 degree celsium..
Heat the chip with round movements..dont heat the centre U may kill the chip…
Tip: make some trainings on half live phones on power chips mostly..in this way U will be sure that phone stays alive..
Im using a dentist tool to touch the chips..
Dont heat sealed chips..U can kill the phone..
Well this is a very helpfull way of testing but it needs some equipment..
The trick: Get a old battery..open it carefuly…remuve the element..keep the small PCB apply to wires to plus and minus pads of the battery…close back..
Now U need a DC power supply with voltage and current indicators or 3.6V power supply and multimeter..
The point: conect battery to DC unit but it in the phone and power on /sim inserted/
Normal consumption is around 200mA when phone connects to network…100-130mA when lights goes off and after that 10-15mA when get to stand by mode..
During a call consumption is around 250mA /300mA max/ if its more be sure thats a foulty PA..
Phone doesnt lights..conect again try power on:
Consumtion is 30mA and over…phone needs to be flashed..
Consumption is 20mA and less..Flash chip must be changet and after that flash…
Consuption is around 10mA..change 26MHz osscilator..If not help problem is flash chip…
Tips..
Its perfect if U find a BLB-2 /8210/ it fits on many models including 3310..
U can also use this little tool when U flash phones-100% garantee..
1.Needed equipment:
SMD rework soldering station
Soldering iron
Mignifier lamp
BGA plate /look at the attachment/
Flux / I use liquid flux/
Thinol paste /I use american, signature 069000 or something like that/
Resoldering wire
Twizels
Small knife
Dentist tool
2. Removing
With the rework station at max 320 degree celsium heat the chip till its posible to pick it up that aprox 40 sec/ dont pick it emidiatly whait some more time and than pick it up…After that heat the PCB some more time~10 sec.
With the soldering iron and resoldering wire and flux clean the PCB / very carefull here tuoch the soldering iron to the resoldering wire wait till it get hot and very gentle slide it to the PCB ever slide it in direction to U not oposite../ let it to get cold..
With the soldering iron and flux clean the bubles from the chip..
Clean bouth PCB and chip with pure alcohol
/I will describe here the procedure when U dont have a brand new chip, brand new chips comes with bubles/
Get the BGA plate clean it very good with pure alkohol….
Find the aproprite sector ..plase it over the chip…Press it with the twizels..
With the knife apply thinol paste /apply here some preasure with the knife/..
slide Ur finger over the plate..gentle no need to apply preasure..
Keeping pressing the plate get the hot air gun /~300 degree celsium/
and heat the plate U will see how bubles will apear after ~15 sec….heat good ~25-30 sec…Still presing the plate wait ~20 and remove twizels…let the plate get cold…With flexing movements of the plate try to remuve the chip…/I personaly after flexing the plate use the twizels and push the bubles/..
when the chip is off the plate heat it again /bubles up/..U will see how bubles goes exatly to their places..let it get cold..Precheck..With the magnifier take a look at the bubles..they must be equal…
Tip:some times one or two bubles are smaler or dont even exist dont worry..without remuving the chip from the plate apply paste again press with the twizels and reheat..or if U have alredy remuved just put it back on the plate and fix the problem..
Mounting the chip.
This is the strongest part of the procedure:-Apply flux over the PCB,Place the chip..there are repers around the place of the chip…fit it good.Get the hot air gun and the dentist tool..heat the chip /careful here ..use low air/ for but 30sec…touch it slightly with the dentist tool,As I said in previos post bout reheating U must see the same behavior of the chip…remuve the air gun…let the PCB get cold…With a multimeter measure the resistance between + and -…must be over 13KOhms.Well thats it…
Tip…make some trainings with dead phones till U are sure Ur skills are good..
more: in most cases problem is not the chip..so U can solve the problem only with making new bubles..
Dentist tool is a tool which dentist use when checking a tooth…
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